PCB-07 · Chapter 10 · PCB Layout, Stack-up & Manufacturing
Designing for yield
A new multilayer board has low first-pass yield at assembly. Most rejects are BGA opens and tombstoned small passives. What do you change in the design?
| Level | ●● onsite technical |
| Track | General board |
| Really testing | DFM mindset — find where yield is lost, then design the cause out. |
Full worked answer: in the book, page 258 — what to say first, how to explain it, the numbers worth quoting and the follow-ups. About the book →
Going deeper
Extra explanation that is not in the book: worked numbers, where people go wrong, and how to say it in the room.
Going deeper for this question is coming.
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